It is a flexible and highly reliable insulating material for power battery module and PACK structure insulation and electronic material packaging insulation. <strong>♦ Features</strong> - Long-term stable adhesion - No residual glue - High stability - High scalability <strong>♦ Application Scenarios</strong> - Semiconductor/LED Chip Cutting - Filter Laser Cutting - Sun lens cutting - Stainless steel die stamping

< 1 > 跳转到