liquid encapsulation

By pouring liquid glue, replacing the existing lamination process, the rapid curing is carried out by light or heat. The adhesive properties, optical properties and mechanical properties are the same as those of the existing adhesive film. The biggest advantage is that the raw material cost and process complexity of the existing adhesive film are greatly reduced.

Photovoltaic Product Applications

Electric Vehicle Product Applications

3C and Semiconductor

Institutional Certification

Our Honors

Products & Solutions

Paint Separation Solutions



Cynagard In10

Application for 1000V modules ·Application for backsheet with Alumin foil ·Excellent insulation performance ·Damp heat resistance ·UV blocking ·Thermal resistance